Time
Speaker
Subject
Morning coffee break
Description
Time
Speaker
Subject
Overview and schedule for the day
Description
Time
Speaker
Michael DiBattista
Subject
UV-Guided Substrate Delayering
Description
A novel method for backside IC delayering using UV photon monitoring and water-assisted FIB sputtering to precisely expose interconnect layers in advanced nodes.
Time
Speaker
James Colvin
Subject
FA Workflow and Sample Preparation
Description
Learn how the Failure Analysis mindset and sensitivity characterization enable fault localization on difficult devices, using external stimulus or device emanation detection.
Time
Speaker
Joy Liao
Subject
Time-Domain Reflectometry in FA
Description
Case studies and developments using EOTPR to enhance chip-level failure analysis alongside traditional techniques.
Time
Speaker
Subject
Coffee break
Description
Time
Speaker
William Lo
Subject
Optical Fault Isolation in Flip-Chip ICs
Description
An overview of key optical techniques—photon emission microscopy, laser voltage probing, and dynamic laser stimulation—used to probe signals in functional silicon flip-chip ICs.
Time
Speaker
David Sampson
Subject
Advances in 4D and Spectral X-ray Micro-CT
Description
Explore cutting-edge mCT developments, including 4D imaging for dynamic materials analysis and spectral imaging for precise material identification, atomic number quantification, and density measurement.
Time
Speaker
Subject
Lunch
Description
Time
Speaker
Subject
Guided Lab Visits
Description
Time
Speaker
Terrence McGuckin
Subject
Digital Twins and Automated Metrology
Description
Highlights advances in physics-aware digital twins, system interoperability, and sub-nanosecond metrology using LBIC and TCAD-feedback integration.
Time
Speaker
Cecile S. Bonifacio
Subject
Ar Ion Milling for Clean SEM/TEM Prep
Description
A streamlined method for artifact-free semiconductor sample prep using broad beam milling, FIB, and ultra-low energy polishing.
Time
Speaker
William A Hubbard
Subject
STEM EBIC for Advanced Semiconductor Analysis
Description
Explore how STEM EBIC enhances traditional TEM by revealing high-resolution electronic contrast, enabling deeper insights into device function and failure mechanisms.
Time
Speaker
Ken Wu
Subject
Advances in Plasma FIB for Failure Analysis
Description
An overview of the latest PFIB technologies, including the multi-ion Helios 5 Hydra system, enabling fast, Ga-free TEM prep and high-quality delayering for advanced semiconductor failure analysis.
Time
Speaker
Subject
Snack break
Description
Time
Speaker
Valerie Brogden
Subject
TEM Prep Evolution and Innovation
Description
From early methods to modern FIB workflows, this talk highlights key advances like EXpressLO grids and Helios 6 tools driving faster, precise, and scalable TEM sample preparation.
Time
Speaker
Rosalinda M. Ring
Subject
AFM-in-SEM for Semiconductor Analysis
Description
An overview of current and emerging applications of AFM-in-SEM for metrology, failure analysis, and nanoscale defect localization in semiconductor devices.
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